最大可堵截的工件尺寸：156×156×700mm
切割速率：1800m/min
机械分量：12500kg
本机械首要用于硅片、玻璃等各类硬、脆性资料切割分化成片状，可到达进步切割精度，进步任务效力，节流原资料，削减下道工序任务量的目标。
The machine is mainly used for cutting and decomposing all kinds of hard and brittle materials such as silicon wafer and glass into sheets, which can improve cutting accuracy, improve work efficiency.