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YJ-XQL850B
最大可堵截的工件尺寸:170×170×900mm切割速率:2100m/min
机械分量:14500kg
本机械首要用于切割太阳能单晶硅、多晶硅资料等,出格合用于170mm×170mm的大尺寸硅片的高效切割利用。
The machine is uniquely designed for cutting solar crystalline silicon, polycrystalline silicon, with a size of 170mm×170mm. 检查概略

YJ-XQL1220A
最大可堵截的工件尺寸:500×280×180mm切割速率:1300m/min
机械分量:7000kg
本机械首要用于将宝石、水晶、石英、单晶硅、磁性资料等各类硬、脆性资料切割分化成条状,可到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is designed for cutting and fragile materials such as diamond, crystal, quartz, monocrystalline silicon, magnetic materials and etc. Which can improve cutting accuracy, work efficiency, save raw materials and reduce the workload of the next process. 检查概略

YJ-XQW916A
最大可堵截的工件尺寸:400×160×100mm切割速率:1300m/min
机械分量:6500kg
本机械首要用于磁性资料、水晶、玻璃、太阳能硅片和硬质合金等硬脆性资料的肆意二维曲面薄片类整机的一次加工成型。同时还可分化成片状,到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is designed for cutting hard and fragile materials such as magnetic material, crystal, glass, silicon, and carbide into different types of curved thin parts at one time. 检查概略

YJ-XQL916A
最大可堵截的工件尺寸:400×220×160mm切割速率:1300m/min
机械分量:6500kg
本机械首要用于将磁性资料、宝石、水晶等各类硬、脆性资料切割分化成片状,可到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is designed for cutting hard and fragile materials such as, magnetic material , diamond, crystal and etc. Magnet filter, It is of high efficiency, and high pricision. 检查概略

YJ-XQL925A
最大可堵截的工件尺寸:600×220×180mm切割速率:1800m/min
机械分量:7500kg
本机械首要用于将磁性资料、宝石、水晶等各类硬、脆性资料切割分化成片状,可到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is designed for cutting hard and brittle materials such as magnetic materials, diamond, crystals and etc. which can improve cutting accuracy, work efficiency, save raw materials and reduce the workload of the next process. 检查概略

YJ-XQB150C
最大可堵截的工件尺寸:150×150×300mm切割速率:700m/min
机械分量:约6000Kg
本机械首要用于切割蓝宝石(2”-6”) 、碳化硅、水晶、陶瓷、单晶硅等各类硬脆性资料。
The machine is designed for cutting hard and fragile materials as well as sapphire(2”-6”), sic, crystal, ceramic, monocrystalline silicon, and etc. 检查概略

YJ-XQB821A
最大可堵截的工件尺寸:150×150×600mm切割速率:1500m/min
机械分量:约12500Kg
本机械首要用于切割蓝宝石(2"-6") 、水晶、陶瓷、化合物、氧化物、天然宝石、单晶硅等各类硬脆性资料切割分化成片状,可到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is designed for cutting hard and fragile materials as well as sapphire, sic, crystal, ceramic, monocrystalline silicon, and etc. 检查概略

YJ-XQB200A
最大可堵截的工件尺寸:200×200×300mm切割速率:1000m/min
机械分量:约7500Kg
本机械首要用于切割蓝宝石(2"-6") 、水晶、陶瓷、化合物、氧化物、天然宝石、单晶硅等各类硬脆性资料切割分化成片状,可到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is designed for cutting hard and fragile materials as well as sapphire, sic, crystal, ceramic, monocrystalline silicon, and etc. 检查概略

YJ-XQL820A
最大可堵截的工件尺寸:500×200×100mm 切割速率:1300m/min
机械分量:6000kg
本机械首要用于将磁性资料、宝石、水晶等各类硬、脆性资料切割分化成片状,可到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is designed for cutting hard and fragile materials such as, magnetic material, diamond, crystal and etc. 检查概略

YJ-XQ120A
最大可堵截的工件尺寸:100×120×75mm切割速率:280m/min
机械分量:约1520Kg
本机械首要用于切割水晶、石英、单晶硅、磁性资料等各类硬、脆性资料。
The machine is designed for cutting hard and fragile materials such as crystal,quartz, monocrystalline silicon, and magnetic materials, and etc. 检查概略

YJ-XQL827A
最大可堵截的工件尺寸:156×156×700mm切割速率:1800m/min
机械分量:12500kg
本机械首要用于硅片、玻璃等各类硬、脆性资料切割分化成片状,可到达进步切割精度,进步任务效力,节流原资料,削减下道工序任务量的目标。
The machine is mainly used for cutting and decomposing all kinds of hard and brittle materials such as silicon wafer and glass into sheets, which can improve cutting accuracy, improve work efficiency. 检查概略
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