被加工件最大厚度：55mm
被加工件最大直径：φ454mm
机械分量：约8800
本机械首要用于硅片、砷化镓片、陶瓷片、石英晶体及别的半导体资料的双面高精度研磨或抛光，也合用于别的金属、非金属、光学玻璃等硬、脆、薄资料的双面高精度研磨或抛光。
The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials.