被加工件最大厚度：20mm
被加工件最大直径：280mm
机械分量：约3450kg
本机械首要用于光学玻璃、视窗玻璃、陶瓷、蓝宝石等电子、光学资料的紧密立体抛光；同时也合用于超薄、脆性资料建造的整机，如阀板、阀片、刚性密封垫、活塞环、石英晶体、玻璃、宝石、别的金属、非金属等的紧密立体抛光。
The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include optic glass, cover lens, ceramic, sapphire, silicon wafer, quartz crystal, and other hard and fragile materials.