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YJ-9.6B10L/PA&YJ-9B5L/PA
被加工件最大厚度：20mm被加工件最大直径：180mm
机械分量：约1980kg
本机械首要合用于硅片、石英晶片、光学晶体、玻璃、宝石、铌酸锂、砷化镓、陶瓷片等薄脆金属或非金属的研磨或抛光。 The machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz,optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc. 检查概略
YJ-9.6B10L/PE&YJ-9B5L/PE
被加工件最大厚度：20mm被加工件最大直径：180mm
机械分量：约1900kg
本机械首要合用于硅片、石英晶片、光学晶体、玻璃、宝石、铌酸锂、砷化镓、陶瓷片等薄脆金属或非金属的研磨或抛光。 The machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc. 检查概略
YJ-13B5L/PA
被加工件最大厚度：25mm被加工件最大直径：270mm
机械分量：约3200kg
本机械首要用于半导体资料、金属、非金属工件（如阀板、刚性密封垫、活塞环、宝石成品、玻璃成品等）的立体研磨。也合用于超薄、脆性资料制成工件（如石英晶体）的研磨。 This machine is suitable for lapping and polishing of semi-conductor material, metal, and non -metal parts such as valve plate, rigid seal pad, piston ring, sapphire, and glass, as well as ultra-thin and fragile parts, such as quartz crystal. 检查概略
YJ-13B6L/PA
被加工件最大厚度：20mm被加工件最大直径：270mm
机械分量：约2500kg
本机械首要合用于手机视窗、硅片、石英晶片、光学晶体、光学玻璃、铌酸锂、砷化镓、陶瓷片等薄脆金属或非金属的研磨或抛光。 The machine is suitable for lapping and polishing of cell phone cover lens, silicon wafer, crystal quartz, optical crystal, optical glass, lithium niobium acid, gallium arsenide, ceramic wafer and other hard and fragile metal or non-metal materials. 检查概略
YJ-13B6L/PD
最大工件厚度：20mm 最大工件直径：270mm
机械分量：2850kg
本机械首要合用于手机视窗、硅片、石英晶片、光学晶体、光学玻璃、铌酸锂、砷化镓、陶瓷片等薄脆金属或非金属的研磨或抛光。 The machine is suitable for lapping and polishing of cell phone cover lens, silicon wafer, crystal quartz, optical crystal, optical glass, lithium niobium acid, gallium arsenide, ceramic wafer and other hard and fragile metal or non-metal materials. 检查概略
YJ-15B7L/PB
被加工件最大厚度：20mm被加工件最大直径：280mm
机械分量：约3450kg
本机械首要用于光学玻璃、视窗玻璃、陶瓷、蓝宝石等电子、光学资料的紧密立体抛光；同时也合用于超薄、脆性资料建造的整机，如阀板、阀片、刚性密封垫、活塞环、石英晶体、玻璃、宝石、别的金属、非金属等的紧密立体抛光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include optic glass, cover lens, ceramic, sapphire, silicon wafer, quartz crystal, and other hard and fragile materials. 检查概略
YJ-15B7L/PC
被加工件最大厚度：20mm被加工件最大直径：280mm
机械分量：约3450kg
本机械首要用于光学玻璃、视窗玻璃、陶瓷、蓝宝石等电子、光学资料的紧密立体抛光；同时也合用于超薄、脆性资料建造的整机，如阀板、阀片、刚性密封垫、活塞环、石英晶体、玻璃、宝石、别的金属、非金属等的紧密立体抛光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include optic glass, cover lens, ceramic, sapphire, silicon wafer, quartz crystal, and other hard and fragile materials. 检查概略
YJ-16B5L/PE
被加工件最大厚度：35mm被加工件最大直径：φ380mm
机械分量：约4200kg
本机械合用于硅片、石英晶片、宝石片、光学水晶、光学玻璃、铌酸锂、陶瓷片、玻璃及别的硬脆资料的双面紧密研磨加工。 The machine is suitable for double-side precision lapping and polishing of silicon wafer, crystal quartz wafer, sapphire wafer, optical crystal, optical glass, lithium niobium acid, ceramic wafer, and other hard and fragile materials. 检查概略
YJ-16B8L/PB
被加工件最大厚度：30mm被加工件最大直径：φ290mm
机械分量：约4200Kg
本机械首要用于硅片、砷化镓片、陶瓷片、石英晶体及其余半导体资料的双面高精度研磨或抛光，也合用于其余金属、非金属、光学玻璃、蓝宝石等硬、脆、薄资料的双面高精度研磨或抛光。 This machine is suitable for double-side precision lapping and polishing of silicon wafer, crystal quartz wafer, sapphire wafer, optical crystal, optical glass, lithium niobium acid, ceramic wafer, and other hard and fragile materials. 检查概略
YJ-20B5L/PA
被加工件最大厚度：55mm被加工件最大直径：φ454mm
机械分量：约8800
本机械首要用于硅片、砷化镓片、陶瓷片、石英晶体及别的半导体资料的双面高精度研磨或抛光，也合用于别的金属、非金属、光学玻璃等硬、脆、薄资料的双面高精度研磨或抛光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials. 检查概略
YJ-22B5L/PA
被加工件最大厚度：40mm被加工件最大直径：φ470mm
机械分量：约9000kg
本机械首要用于硅片、砷化镓片、陶瓷片、石英晶体及别的半导体资料的双面高精度研磨或抛光，也合用于别的金属、非金属、光学玻璃等硬、脆、薄资料的双面高精度研磨或抛光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials. 检查概略
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